Boron Nitride Sputtering Target

Boron Nitride Sputtering Target List

Product Name	Shape	Purity	Size (inch)	Thickness (mm)
Boron Nitride Sputtering Target	Circular	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Rectangular	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Annular	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Oval	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Cylindrical	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Planar	99.5% - 99.9%	0 - 48	≥ 1
Boron Nitride Sputtering Target	Rotatable (rotary)	99.5% - 99.9%	0 - 48	≥ 1

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Boron nitride, the chemical formula is BN. The melting point is 3000 ℃. It is resistant to chemical attack and is not eroded by inorganic acid and water. Boron nitride begins to oxidize in air above 1200 ℃. It is slightly soluble in hot acid and insoluble in cold water, with a relative density of 2.25. The compressive strength is 170 MPa.

Boron nitride sputtering target is a kind of high purity boron nitride raw material by sputtering deposition. According to the different shapes, boron nitride sputtering targets can be divided into circular, rectangular, square, annular, oval, cylindrical, planar, rotatable (rotary) boron nitride targets. Boron nitride can be used as high temperature, high pressure, insulation, heat dissipation parts, high temperature solid lubricant, extrusion anti-wear additives, additives for ceramic composite materials, refractory materials and antioxidant additives, especially for the occasions of resisting molten metal corrosion, heat enhancement additives and high temperature resistant insulating materials.

Boron Nitride Sputtering Target Application

Boron nitride sputtering target can be used in many applications. The details are as follows:
- Semiconductor;
- Chemical vapor deposition (CVD) display;
- Physical vapor deposition (PVD) display;
- Optical applications.