Molybdenum Disilicide Sputtering Target

Molybdenum Disilicide Sputtering Target List

Product Name	Shape	Purity	Size (inch)	Thickness (mm)
Molybdenum Disilicide Sputtering Target	Circular	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Rectangular	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Annular	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Oval	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Cylindrical	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Planar	99.5% - 99.9%	0 - 48	≥ 1
Molybdenum Disilicide Sputtering Target	Rotatable (rotary)	99.5% - 99.9%	0 - 48	≥ 1

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Molybdenum disilicide is a gray metallic-looking material with tetragonal crystal structure (alpha-modification). The melting point is 2030 °C, and is electrically conductive. At high temperatures it forms a passivation layer of silicon dioxide, protecting it from further oxidation. Molybdenum disilicide is insoluble in most acids but soluble in nitric acid and hydrofluoric acid.

Molybdenum disilicide sputtering target is a kind of high purity molybdenum disilicide raw material by sputtering deposition. According to the different shapes, molybdenum disilicide sputtering targets can be divided into circular, rectangular, square, annular, oval, cylindrical, planar, rotatable (rotary) molybdenum disilicide targets. Molybdenum disilicide can be used for temperatures up to 1800 °C, in electric furnaces used in laboratory and production environment in production of glass, steel, electronics, ceramics, and in heat treatment of materials. Molybdenum disilicide also can be used in microelectronics as a contact material. 

Molybdenum Disilicide Sputtering Target Application

Molybdenum disilicide sputtering target can be used in many applications. The details are as follows:
- Semiconductor;
- Chemical vapor deposition (CVD) display;
- Physical vapor deposition (PVD) display;
- Optical applications.