Silicon Sputtering Target

Silicon Sputtering Target List

Product Name	Shape	Purity	Size (inch)	Thickness (mm)
Silicon Sputtering Target	Circular	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Rectangular	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Annular	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Oval	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Cylindrical	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Planar	99.99% - 99.999%	0 - 48	≥ 1
Silicon Sputtering Target	Rotatable (rotary)	99.99% - 99.999%	0 - 48	≥ 1

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Silicon is a hard metal with metallic luster. The chemical symbol is Si, the atomic number is 14, and the relative atomic mass is 28.0855. There are amorphous silicon and crystalline silicon in silicon. Crystalline silicon is gray black and amorphous silicon is black. The density is 2.32-2.34g/cm3, melting point is 1410 ℃, boiling point is 2355 ℃. Silicon is insoluble in water, nitric acid and hydrochloric acid, but soluble in hydrofluoric acid and alkali.

Silicon sputtering target is a kind of high purity silicon raw material by sputtering deposition. According to the different shapes, silicon sputtering targets can be divided into circular, rectangular, square, annular, oval, cylindrical, planar, rotatable (rotary) silicon targets. Silicon can be used in semiconductor, cermet, communication, aerospace, electronic and electrical, construction, transportation, chemical, textile, food, light industry, medical and other industries. High purity monocrystalline silicon is an important semiconductor material. P-type silicon semiconductors can be formed by doping a small amount of group IIIA elements into monocrystalline silicon, and n-type semiconductors can be formed by doping a small amount of Group VA elements. Silicon is also an important material for cermet and spaceflight, which can be used in the manufacture of military weapons. In addition, silicon can also be used for optical fiber communication.

Silicon Sputtering Target Application

High purity silicon sputtering target produced by FUSHEL has the highest possible density and smallest possible average grain sizes. It can be used in many applications. The details are as follows:
- Optical and decoration coating;
- Semiconductor and thin film solar energy;
- Flat panel displays.