Tin Silver Copper Alloy Sputtering Target (Sn-Ag-Cu)
AvailableTin Silver Copper Alloy Sputtering Target for SaleWholesale & RetailManufacturer & SupplierFactory Supply
Symbol: SnAgCuPurity: 99.99%Size: 0 - 48 inchThickness: ≥ 1 mmShape: Circular, rectangular, annular, rotary etc.Ships to: Worldwide
Tin Silver Copper Alloy Sputtering Target List
Product Name |
Shape |
Purity |
Size (inch) |
Thickness (mm) |
Tin Silver Copper Alloy Sputtering Target |
Circular |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Rectangular |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Annular |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Oval |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Cylindrical |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Planar |
99.99% |
0 - 48 |
≥ 1 |
Tin Silver Copper Alloy Sputtering Target |
Rotatable (rotary) |
99.99% |
0 - 48 |
≥ 1 |
Note: We provide customized service. If you don't find the sputtering targets you want, please send us an email directly. We can customize it according to your requirements.
Tin silver copper alloy sputtering target is a kind of ternary alloy sputtering target made of high-purity
tin powder, silver powder, and
copper powder in a certain proportion. After the tin silver copper alloy sputtering target is made into a tin silver copper alloy blank through a special production process, it is machined according to the size and shape required by customers, and finally the finished product is presented through vacuum packaging.
According to different shapes, tin silver copper alloy sputtering targets can be divided into circular, planar, cylindrical, disc, etc. tin silver copper alloy targets. We can customize tin silver copper alloy sputtering targets with different shapes and chemical composition according to customers' requirements.
Tin Silver Copper Alloy Sputtering Target Application
Tin silver copper alloy sputtering target can be used in many applications. The details are as follows:
- Chemical vapor deposition (CVD);
- Physical vapor deposition (PVD);
- Used for preparing tin silver copper alloy films.