Tin Sputtering Target

Tin Sputtering Target List

Product Name	Shape	Purity	Size (inch)	Thickness (mm)
Tin Sputtering Target	Circular	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Rectangular	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Annular	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Oval	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Cylindrical	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Planar	99.9% - 99.99%	0 - 48	≥ 1
Tin Sputtering Target	Rotatable (rotary)	99.9% - 99.99%	0 - 48	≥ 1

Note: We provide customized service. If you don't find the sputtering targets you want, please send us an email directly. We can customize it according to your requirements.

Tin is a low melting point metal with silver white luster. The chemical symbol is Sn. The specific gravity is 7 . The melting point is 232 ℃. Tin chemical properties are very stable, at room temperature is not easy to be oxidized by oxygen, so it often keeps silver glittering luster. Tin has good expansibility at room temperature. Especially at 100 ℃, it has very good expansibility and can be developed into extremely thin tin foil. Tin is inert and does not react with air or water. It reacts slowly with dilute hydrochloric acid and reacts with concentrated hydrochloric acid to form stannous chloride; It does not react with dilute sulfuric acid, but reacts with concentrated hot sulfuric acid to form tin sulfate ( IV )； Formed with concentrated hot nitric acid β- Stannic acid.

Tin sputtering target is a kind of high purity tin raw material by sputtering deposition. According to the different shapes, tin sputtering targets can be divided into circular, rectangular, square, annular, oval, cylindrical, planar, rotatable (rotary) tin targets. Tin can be used to make alloy, bronze, pigment, enamel, white glaze and opal glass.

Tin Sputtering Target Application

Tin sputtering target can be used in many applications. The details are as follows:
- Electronics;
- Semiconductor;
- Flat panel displays.