Titanium Copper Alloy Sputtering Target (Ti-Cu)
AvailableTitanium Copper Alloy Sputtering Target for SaleWholesale & RetailManufacturer & SupplierFactory Supply
Symbol: TiCuPurity: 99.5%Size: 0 - 48 inchThickness: ≥ 1 mmShape: Circular, rectangular, annular, rotary etc.Ships to: Worldwide
Titanium Copper Alloy Sputtering Target List
Product Name |
Shape |
Purity |
Size (inch) |
Thickness (mm) |
Titanium Copper Alloy Sputtering Target |
Circular |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Rectangular |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Annular |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Oval |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Cylindrical |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Planar |
99.5% |
0 - 48 |
≥ 1 |
Titanium Copper Alloy Sputtering Target |
Rotatable (rotary) |
99.5% |
0 - 48 |
≥ 1 |
Note: We provide customized service. If you don't find the sputtering targets you want, please send us an email directly. We can customize it according to your requirements.
Titanium copper alloy sputtering target is a kind of binary alloy sputtering target made of high-purity metal titanium powder and metal
copper powder in a certain proportion. After the titanium copper alloy sputtering target is made into a blank through a special production process, it is machined according to the size and shape required by customers, and finally the finished product is presented through vacuum packaging.
According to different shapes, titanium copper alloy sputtering targets can be divided into circular, planar, cylindrical, disc, etc. titanium copper alloy targets. We can customize titanium copper alloy sputtering targets with different shapes according to customers' requirements, or we can customize targets with different titanium copper alloy compositions according to customers' chemical composition requirements.
Titanium Copper Alloy Sputtering Target Application
Titanium copper alloy sputtering target can be used in many applications. The details are as follows:
- Chemical vapor deposition (CVD);
- Physical vapor deposition (PVD);
- Used for preparing titanium copper alloy films.