Planar Aluminum Sputtering Target List
| Product Name |
Purity |
Size (inch) |
Thickness (mm) |
| Planar Aluminum Sputtering Target |
99.99% - 99.9995% |
0 - 48 |
≥ 1 |
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Planar aluminum sputtering targets are the most basic and widely used standard form of target materials in physical vapor deposition (PVD) sputtering processes. They specifically refer to solid aluminum or aluminum alloy target blanks with a flat (rectangular or circular) shape.
In a vacuum chamber, the planar target functions as the cathode. When bombarded by positively charged argon ions or other particles, the surface atoms are ejected and deposited onto the substrate (such as silicon wafers or glass) placed opposite the target, forming a thin film. The "planar" shape distinguishes it from "rotary cylindrical targets," affecting the specific electric field distribution, sputter etching trajectory, and material utilization pattern.
Core Features:
Fixed Shape: Once installed, the position is fixed and cannot rotate.
Concentrated Sputter Area: Plasma bombardment forms an elliptical, ring-shaped etch groove (Race Track) on the target surface.
Limited Material Utilization: Due to the concentrated etching in a specific area, the actual utilization rate is usually 20%-40%, much lower than that of rotary targets (>80%).
Mature and Stable Process: With its simple structure, rich manufacturing experience, and a well-established process parameter database, planar targets are the first choice for many standard processes.
Core Value:Despite lower material utilization, planar targets are irreplaceable in fields like semiconductors and precision optics, where uniformity and defect control are crucial. Their excellent process stability, superior thin film uniformity control (especially for small substrates), lower initial investment, and simpler maintenance make them indispensable.
Planar Aluminum Sputtering Target Application
Due to their excellent uniformity and controllability, planar
aluminum sputtering targets play a critical role in high-end manufacturing fields.
1. Semiconductor Integrated Circuit (IC) Manufacturing:This is the most demanding and high-level application for planar targets, where bonded planar targets are exclusively used.
Applications: Mainly used for the preparation of metal interconnections, via plugs, and bonding pads.
Technical Requirements: 5N or higher ultra-high-purity aluminum or aluminum alloy targets must be used. The grain size must be uniform and small (usually <100μm) to reduce sputter particle contamination. High bonding strength is required to ensure uniform cooling under high power, with no risk of solder detachment.
Typical Specifications: Commonly 8-inch (200mm) and 12-inch (300mm) circular planar targets, matching the wafer sizes.
2. Flat Panel Display Manufacturing:In TFT-LCD and OLED production lines, planar targets are primarily used in PVD chambers for metal layer deposition.
Applications: Deposition of gate, source, drain, and data lines in the TFT array.
Technical Requirements: 4N5-5N high-purity aluminum or Al alloy targets are used. The target size needs to be extremely large (to match G6 to G10.5 glass substrates), with highly uniform composition and structure to ensure consistent film resistance across a large substrate area.
Typical Form: Large rectangular planar targets, oriented perpendicularly to the scanning direction of the glass substrates, with large-area coating achieved through magnetron scanning.
3. Precision Optical Components and Decorative Coatings:Applications:
Optical Mirrors: Aluminum films are sputtered on telescopes, lasers, and optical instruments for high-reflectivity coatings, typically followed by a protective layer.
Decorative Coatings: Used on mobile phone frames, eyeglass frames, hardware, etc., providing metallic luster and wear-resistant surfaces.
Technical Requirements: Purity requirements vary based on the application, but all coatings must be dense, have high gloss, and exhibit few defects (e.g., pinholes). Planar targets are easy to maintain and clean, making them ideal for small-batch, flexible production.
4. Semiconductor Packaging and Microelectromechanical Systems (MEMS):Applications:
Advanced Packaging: Used to form conductive lines in re-routing layers (RDL) in fan-out and through-silicon-via (TSV) technologies.
MEMS Devices: Used to manufacture microelectrodes and signal lines in sensors and actuators.
Technical Requirements: High requirements for step coverage, adhesion, and resistivity uniformity in thin films, typically using medium- to high-purity planar aluminum targets.
5. Research and Development:Applications: Small-scale sputtering equipment at universities, research institutes, and corporate R&D centers typically use small circular planar targets (1-4 inches in diameter).
Characteristics: Used for the exploration of new materials and processes, with high demands for target diversity (in terms of composition and purity), but low consumption per process. Planar targets are easy to replace, making them ideal for R&D purposes.
