Rotatable / Rotary Aluminum Sputtering Target (Al)

Rotatable Aluminum Sputtering Target List

Product Name	Purity	Size (inch)	Thickness (mm)
Rotatable Aluminum Sputtering Target	99.99% - 99.9995%	0 - 48	≥ 1

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Rotary aluminum sputtering targets are an efficient and advanced target form used in physical vapor deposition (PVD) sputtering processes. The core feature of this type of target is that it is a hollow cylindrical (tube-shaped) material that can rotate at high speeds around its axis during the sputtering process.

Operating Principle:

In a vacuum chamber, the rotary target functions as the cathode, with its outer surface receiving uniform bombardment from the plasma ring region. As the target rotates, its entire cylindrical surface is sequentially etched, ensuring even consumption in the circumferential direction.
Core Advantages and Value:
Ultra-high Material Utilization: The utilization rate typically reaches 70%-85%, which is 2-4 times that of planar targets (20%-40%). This significantly reduces the cost of expensive high-purity materials, offering substantial economic benefits, especially in large-scale production.
Stable Deposition Rate and Long Lifespan: The even etching process prevents the "race track" deep grooves seen in planar targets, maintaining a stable sputtering rate throughout the target's life cycle, and extending the continuous production time of a single target.
Excellent Thin Film Uniformity: For large-area substrates (such as display panels), combined with magnetron systems and relative movement of the substrate, rotary targets provide excellent film thickness uniformity along the width.
Lower Particle Contamination: Uniform etching and reduced thermal load minimize microscopic "splashing" and abnormal discharges from the target surface, reducing defect density in the thin film.
High Power Operating Capacity: Internal cooling channels allow for efficient heat dissipation, enabling the system to run stably at higher power levels, thus improving production efficiency.

Rotatable Aluminum Sputtering Target Application

The core application scenarios of rotary aluminum sputtering targets are centered around large-scale, large-area, and continuous substrate coating needs.
1. Flat Panel Display Manufacturing
Application Areas: In the TFT-LCD and OLED array processes, rotary targets are used to deposit all metal layers such as gate electrodes, source/drain electrodes, and data lines.
Technical Requirements: Bonded high-purity aluminum or Al-Si alloy rotary targets must be used. The targets must meet:
Extremely Long Length: Must fully cover the width of large glass substrates (e.g., for G10.5 glass substrates, which are approximately 3 meters wide, the target length must be even longer).
High Straightness and Concentricity: To ensure a constant distance between the target surface and the substrate during rotation, which is critical for uniform film thickness.
Uniform Composition and Microstructure: The sputtering characteristics of the entire target tube must be consistent at any position.
Process Characteristics: Glass substrates pass under the target at a constant speed while the target rotates at high speeds, and the precise magnetic field allows for high-efficiency, high-uniformity coating. This is the standard configuration in modern display panel factories.
2. Architectural and Automotive Coating Glass
Application Areas: Used to produce low-emissivity (Low-E) glass, solar control coated glass, mirror glass, etc. Aluminum films are often used as reflective layers, blocking layers, or conductive layers in functional films.
Technical Requirements: High-purity aluminum rotary targets are primarily used. Given that the production line operates 24/7, the stability, lifespan, and cost of the targets are crucial. The high material utilization rate is the key reason rotary targets replace planar targets in this field.
3. Flexible Electronics and Thin-Film Solar Cells:
Application Areas:
Flexible Printed Circuits (FPC): Used to manufacture conductive circuits on flexible substrates like polyimide (PI).
Flexible Displays: Depositing TFT metal layers on flexible plastic substrates.
Thin-Film Solar Cells (e.g., CIGS): Used as back electrodes or interconnect wires in modules.
Technical Requirements: Aluminum or aluminum alloy rotary targets compatible with flexible processing are needed. The thin film must meet specific requirements for adhesion, flexibility, and resistivity.
4. Large-Scale Optical Coating and Packaging Materials:
Application Areas:
Packaging Films: Sputtering ultra-thin aluminum layers onto plastic films (such as PET) for high-barrier packaging and decorative uses in food and pharmaceutical packaging.
Functional Roll-to-Roll Coatings: For capacitor films, electromagnetic shielding films, etc.
Technical Requirements: Cost-optimized high-purity aluminum rotary targets are used. A "Roll-to-Roll" production method is employed, requiring high stability in the deposition rate to ensure uniform performance across the entire roll of product.
5. Some Applications in Semiconductor Packaging:
Application Areas: Used in advanced packaging processes (such as Fan-Out Panel Level Packaging, FOPLP) to deposit conductive metals on larger square panels for re-routing layers (RDL).
Technical Requirements: As the packaging size increases, the advantages of rotary targets in terms of large-area uniformity and cost efficiency become apparent, leading them to replace multiple planar targets.