High Purity Aluminum Sputtering Target (Al)

High Purity Aluminum Sputtering Target List

Product Name	Shape	Purity	Size (inch)	Thickness (mm)
High Purity Aluminum Sputtering Target	Circular	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Rectangular	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Annular	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Oval	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Cylindrical	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Planar	99.99% - 99.9995%	0 - 48	≥ 1
High Purity Aluminum Sputtering Target	Rotatable (rotary)	99.99% - 99.9995%	0 - 48	≥ 1

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High-purity aluminum sputtering target material is a key raw material used in physical vapor deposition (PVD) processes for sputter coating. It is defined as a solid target material with an aluminum purity typically no lower than 99.99% (4N). When bombarded by high-energy particles (such as argon ions) in a vacuum environment, its surface atoms or molecules are ejected and deposited onto a substrate (such as a silicon wafer or glass substrate), forming a layer of aluminum or aluminum alloy thin film with specific functions.

Classification by Purity Grade

Purity is the most critical classification criterion, as it directly affects the resistivity, impurity defect density, and the performance and yield of the final device.
4N5 (99.995%): Applied in fields that require strict impurity control, such as electrodes in some high-resolution display panels.
5N (99.999%): The mainstream standard for semiconductor integrated circuit manufacturing. Used for metal interconnections, via plugs, and other components in advanced process nodes ranging from 90nm to 28nm and beyond. This ensures low contact resistance and excellent electromigration reliability.
6N (99.9999%) and above: Used in ultra-high-end semiconductor devices, compound semiconductors, and cutting-edge memory devices (e.g., 3D NAND). The impurity content at this purity level is close to the detection limit, aiming to minimize impurity defects in the thin film, meeting the needs of processes below 10nm.

High Purity Aluminum Sputtering Target Application

High-purity aluminum sputtering targets are deeply integrated into various core sectors of modern electronics and information industries.
1. Semiconductor Integrated Circuit (IC) Manufacturing:
Metal Interconnections and Via Plugs: Aluminum thin films (often alloyed with copper or silicon) are used as "wires" connecting billions of transistors within chips. Aluminum plugs are used to fill micro-holes, ensuring inter-layer connections. The thin film must exhibit ultra-low resistivity, excellent step coverage, and high resistance to electromigration.
Bonding Pads: These metal regions on the chip surface provide the interface for external gold bonding wires, requiring the film to have good adhesion, bondability, and corrosion resistance.
Gate Electrode: In some processes or devices, aluminum is used as the gate material.
2. Flat Panel Displays (FPD):
Thin-Film Transistor Liquid Crystal Displays (TFT-LCD): Used to create the source, drain, and data lines in the TFT array. As display resolution (4K/8K) increases, the aluminum targets require lower resistivity to reduce signal delay. Rotary targets are often used for large-size substrates (such as G10.5 glass substrates) and higher utilization rates.
Organic Light Emitting Diode (OLED): Used for anode modification layers, circuit interconnections, etc. The purity and film quality of the target must be extremely high, as tiny particle defects can cause OLED pixel failure.
Touch Panels: Used to form metal lines beneath transparent conductive oxide (such as ITO) films, serving as auxiliary electrodes to reduce overall resistance.
3. Solar Energy (Photovoltaic) Industry:
Crystalline Silicon Solar Cells: Aluminum films are sputtered onto the back of the cell to form back surface fields (BSF) or passivated contact layers (such as in PERC technology). This helps reflect charge carriers, improving open-circuit voltage and conversion efficiency. This application uses large volumes of material, with cost sensitivity, typically employing 4N-5N purity flat or rotary targets.
Thin-Film Solar Cells (e.g., CIGS): Used for back electrodes or interconnection wires in the modules.
4. Data Storage Disks:
Used for manufacturing aluminum alloy substrates for hard disk platters (e.g., glass substrates), requiring extremely smooth, defect-free surfaces. With increasing storage capacities, the demands for substrate flatness and target purity are rising.
5. Other High-End Applications:
Optical Components: Sputtered aluminum films are used for high-reflectivity layers in precision optical lenses and mirrors. These require high purity, excellent reflectivity, and minimal defects in the film.
Decorative and Functional Coatings: Used for wear-resistant decorative coatings on mobile phone frames, watch cases, and hard-wearing layers on tools.
Semiconductor Packaging: In advanced packaging technologies, used to prepare re-routing layers (RDL) or metalized bumps under bump metallization (UBM) layers.